The Fraunhofer Institute for Process Engineering and Packaging IVV is organising the forum entiteld “News on Packaging Technology” on 11 March 2009 at Anuga FoodTec in Cologne.
The following topics will be presented
-Plasma technology for decontamination of surfaces
-Nanotechnology for packaging
-Certificate of conformity for food packaging
-Optimised CIP-cleaning of food processing machines
-Radio frequency water bath – A new rapid heating process for food in packages
The conference language is English.
The conference fee is € 180 per person.
The fee includes participation in conference and proceedings.
During the Anuga FoodTec on 10-13 March 2009 the Fraunhofer IVV can be found at the stand of the Technische Universität München in Hall 10.1, Stand C-072.
Packaging Technology at FoodTec 2009
News on Packaging Technology
at the Anuga FoodTec 2009
The Fraunhofer Institute for Process Engineering and Packaging IVV is organising the forum entiteld “News on Packaging Technology” on 11 March 2009 at Anuga FoodTec in Cologne.
The following topics will be presented
-Plasma technology for decontamination of surfaces
-Nanotechnology for packaging
-Certificate of conformity for food packaging
-Optimised CIP-cleaning of food processing machines
-Radio frequency water bath – A new rapid heating process for food in packages
The conference language is English.
The conference fee is € 180 per person.
The fee includes participation in conference and proceedings.
The program and further information can be obtained from Petra Gabler at the Fraunhofer IVV, Tel. +49 81 61/491-124, petra.gabler@ivv.fraunhofer.de and www.ivv.fraunhofer.de.
During the Anuga FoodTec on 10-13 March 2009 the Fraunhofer IVV can be found at the stand of the Technische Universität München in Hall 10.1, Stand C-072.
Attachments
ivv_1 (JPG)
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